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        1. 技术服务

          Summary

          来源: 发布时间:2014/6/3 9:56:05 浏览次数:565

             

          Summary

                  The company has a professional package design and simulation team, equipped with a complete, advanced equipment, follow the international recognized quality standards. We provide customers with the best package design and high quality product quality.

             We provide customers including wire bonding package, flip chip packaging, chip scale package (CSP), SIP packaging products, MEMS packaging products, such as advanced manufacturing technology.

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