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        1. 技术服务

          Design services

          来源: 发布时间:2016/4/15 16:21:48 浏览次数:0

             

          HuaTian Package Design Team has totel 15 members, all have rich experience that can help customers determine the optimum package for complex integrated circuits, assist customers in designing a package substrate to meet the customer's power, ground and I/O requirements for each pin and conduct thermal and electrical simulations.

              Package Design Team services include:

          ?  Customer-centric design.

          ?  High quality, reliable, and cost effective packaging proposal.

          ?  DFM (Design For Manufacturing) and DFC (Design for Cost).

          ?  Supporting auto- check of design and Drawings.

          Design Capabilities:

             Multi-Chip ModulesMCM

             System-in-Package (SiP)

             Flip Chip Package

             Hybrid Package

             Package-in-Package (PiP)

             Package-on-Package (PoP)

             Embedded Package

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